Datasheet page describing the mechanical dimensions of AMD/Xilinx'es VSVA1365 Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring BGA package. It includes a highlighted note reading: IMPORTANT: This package includes land-side capacitors (LSC), a region of the BGA matrix where the BGA balls are replaced with capacitors. The LSC ball grid size for this package is 5 x 5 in terms of the number of BGA balls replaced by capacitors. Therefore, this package has fewer balls than the package name implies (i.e., the package has 5 x 5 = 25 fewer balls than the implied 1365 balls).